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Translated using Weblate (Chinese (Simplified Han script))

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Currently translated at 96.9% (10164 of 10488 strings)

Translation: KiCad EDA/master source
Translate-URL: https://hosted.weblate.org/projects/kicad/master-source/zh_Hans/
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CloverGit 2025-08-19 05:32:10 +02:00 committed by Hosted Weblate
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translation/pofiles/zh_CN.po
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@ -42,7 +42,7 @@ msgstr ""
"Project-Id-Version: KiCad_zh_CN_Master_v0.0.32\n"
"Report-Msgid-Bugs-To: \n"
"POT-Creation-Date: 2025-08-17 01:15+0300\n"
"PO-Revision-Date: 2025-08-18 07:02+0000\n"
"PO-Revision-Date: 2025-08-19 08:02+0000\n"
"Last-Translator: CloverGit <w991593239@163.com>\n"
"Language-Team: Chinese (Simplified Han script) <https://hosted.weblate.org/"
"projects/kicad/master-source/zh_Hans/>\n"
@ -40176,7 +40176,7 @@ msgstr "电路板上, 非铜层"
#: pcbnew/dialogs/panel_setup_layers.cpp:188
msgid "If you want a solder paste layer for front side of the board"
msgstr "如果您希望在电路板正面使用焊膏层"
msgstr "如果您希望在电路板正面使用锡膏层"
#: pcbnew/dialogs/panel_setup_layers.cpp:206
msgid "If you want a silk screen layer for the front side of the board"
@ -45515,7 +45515,7 @@ msgstr "(贴片焊盘在电路板的不同面上分别有铜层和阻焊层)"
#: pcbnew/pad.cpp:2356 pcbnew/pad.cpp:2369
msgid "(SMD pad has copper and paste layers on different sides of the board)"
msgstr "(贴片焊盘的铜层和焊膏层分别处在电路板的不同面上)"
msgstr "(贴片焊盘的铜层和锡膏层分别处在电路板的不同面上)"
#: pcbnew/pad.cpp:2375
msgid "(SMD pad has no outer layers)"
@ -45544,25 +45544,25 @@ msgstr "(焊盘孔不在焊盘形状内)"
#: pcbnew/pad.cpp:2450
msgid "(negative local clearance values have no effect)"
msgstr "(负局部间距值无效)"
msgstr "(负的局部间距值无效)"
#: pcbnew/pad.cpp:2469
msgid ""
"(negative solder mask clearance is larger than some shape primitives; "
"results may be surprising)"
msgstr "(负阻焊间距大于某些形状原型; 可能产生意料之外的结果)"
msgstr "(负的阻焊间距大于某些形状原型; 可能产生意料之外的结果)"
#: pcbnew/pad.cpp:2479
msgid ""
"(negative solder mask clearance is larger than pad; no solder mask will be "
"generated)"
msgstr "(负阻焊间距大于焊盘; 不会生成阻焊层)"
msgstr "(负的阻焊间距大于焊盘; 不会生成阻焊层)"
#: pcbnew/pad.cpp:2498
msgid ""
"(negative solder paste margin is larger than pad; no solder paste mask will "
"be generated)"
msgstr "(负焊膏余量大于焊盘; 不会生成锡膏层)"
msgstr "(锡膏的内缩量超过焊盘尺寸, 不会生成该焊盘的锡膏层)"
#: pcbnew/pad.cpp:2505
msgid "(negative corner radius is not allowed)"