mirror of
https://gitlab.com/kicad/code/kicad.git
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a43ca978df
Building the 3D data is time consuming, so creating the data after the 3D frame is shown is better, and the build activity is visible, especially on Linux.
552 lines
17 KiB
C++
552 lines
17 KiB
C++
/*
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* This program source code file is part of KiCad, a free EDA CAD application.
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*
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* Copyright (C) 2015-2016 Mario Luzeiro <mrluzeiro@ua.pt>
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* Copyright (C) 1992-2021 KiCad Developers, see AUTHORS.txt for contributors.
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*
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* This program is free software; you can redistribute it and/or
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* modify it under the terms of the GNU General Public License
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* as published by the Free Software Foundation; either version 2
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* of the License, or (at your option) any later version.
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*
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* This program is distributed in the hope that it will be useful,
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* but WITHOUT ANY WARRANTY; without even the implied warranty of
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* MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
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* GNU General Public License for more details.
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*
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* You should have received a copy of the GNU General Public License
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* along with this program; if not, you may find one here:
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* http://www.gnu.org/licenses/old-licenses/gpl-2.0.html
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* or you may search the http://www.gnu.org website for the version 2 license,
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* or you may write to the Free Software Foundation, Inc.,
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* 51 Franklin Street, Fifth Floor, Boston, MA 02110-1301, USA
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*/
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/**
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* @file cinfo3d_visu.cpp
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* @brief Handles data related with the board to be visualized
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*/
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#include "../3d_rendering/camera.h"
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#include "board_adapter.h"
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#include <board_design_settings.h>
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#include <3d_rendering/3d_render_raytracing/shapes2D/polygon_2d.h>
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#include <board.h>
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#include <3d_math.h>
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#include "3d_fastmath.h"
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#include <geometry/geometry_utils.h>
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#include <convert_to_biu.h>
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#include <pgm_base.h>
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#include <settings/settings_manager.h>
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#include <wx/log.h>
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/**
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* Trace mask used to enable or disable the trace output of this class.
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* The debug output can be turned on by setting the WXTRACE environment variable to
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* "KI_TRACE_EDA_CINFO3D_VISU". See the wxWidgets documentation on wxLogTrace for
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* more information.
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*
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* @ingroup trace_env_vars
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*/
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const wxChar *BOARD_ADAPTER::m_logTrace = wxT( "KI_TRACE_EDA_CINFO3D_VISU" );
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BOARD_ADAPTER::BOARD_ADAPTER() :
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m_board( nullptr ),
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m_3dModelManager( nullptr ),
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m_colors( nullptr ),
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m_layerZcoordTop(),
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m_layerZcoordBottom()
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{
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wxLogTrace( m_logTrace, wxT( "BOARD_ADAPTER::BOARD_ADAPTER" ) );
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m_gridType = GRID3D_TYPE::NONE;
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m_antiAliasingMode = ANTIALIASING_MODE::AA_8X;
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m_drawFlags.resize( FL_LAST, false );
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if( PgmOrNull() )
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m_colors = Pgm().GetSettingsManager().GetColorSettings();
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m_renderEngine = RENDER_ENGINE::OPENGL_LEGACY;
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m_materialMode = MATERIAL_MODE::NORMAL;
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m_boardPos = wxPoint();
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m_boardSize = wxSize();
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m_boardCenter = SFVEC3F( 0.0f );
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m_boardBoundingBox.Reset();
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m_throughHoleIds.Clear();
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m_throughHoleOds.Clear();
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m_throughHoleAnnularRings.Clear();
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m_copperLayersCount = -1;
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m_epoxyThickness3DU = 0.0f;
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m_copperThickness3DU = 0.0f;
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m_nonCopperLayerThickness3DU = 0.0f;
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m_solderPasteLayerThickness3DU = 0.0f;
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m_biuTo3Dunits = 1.0;
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m_trackCount = 0;
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m_viaCount = 0;
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m_averageViaHoleDiameter = 0.0f;
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m_holeCount = 0;
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m_averageHoleDiameter = 0.0f;
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m_averageTrackWidth = 0.0f;
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SetFlag( FL_USE_REALISTIC_MODE, true );
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SetFlag( FL_FP_ATTRIBUTES_NORMAL, true );
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SetFlag( FL_SHOW_BOARD_BODY, true );
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SetFlag( FL_CLIP_SILK_ON_VIA_ANNULUS, false );
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SetFlag( FL_FP_ATTRIBUTES_NORMAL, true );
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SetFlag( FL_FP_ATTRIBUTES_NORMAL_INSERT, true );
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SetFlag( FL_FP_ATTRIBUTES_VIRTUAL, true );
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SetFlag( FL_ZONE, true );
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SetFlag( FL_SILKSCREEN, true );
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SetFlag( FL_SOLDERMASK, true );
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SetFlag( FL_SUBTRACT_MASK_FROM_SILK, false );
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SetFlag( FL_RENDER_OPENGL_COPPER_THICKNESS, true );
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SetFlag( FL_RENDER_OPENGL_AA_DISABLE_ON_MOVE, false );
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SetFlag( FL_RENDER_OPENGL_THICKNESS_DISABLE_ON_MOVE, false );
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SetFlag( FL_RENDER_OPENGL_VIAS_DISABLE_ON_MOVE, false );
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SetFlag( FL_RENDER_OPENGL_HOLES_DISABLE_ON_MOVE, false );
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SetFlag( FL_USE_SELECTION, true );
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SetFlag( FL_HIGHLIGHT_ROLLOVER_ITEM, true );
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m_BgColorBot = SFVEC4F( 0.4, 0.4, 0.5, 1.0 );
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m_BgColorTop = SFVEC4F( 0.8, 0.8, 0.9, 1.0 );
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m_BoardBodyColor = SFVEC4F( 0.4, 0.4, 0.5, 0.9 );
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m_SolderMaskColorTop = SFVEC4F( 0.1, 0.2, 0.1, 0.83 );
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m_SolderMaskColorBot = SFVEC4F( 0.1, 0.2, 0.1, 0.83 );
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m_SolderPasteColor = SFVEC4F( 0.4, 0.4, 0.4, 1.0 );
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m_SilkScreenColorTop = SFVEC4F( 0.9, 0.9, 0.9, 1.0 );
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m_SilkScreenColorBot = SFVEC4F( 0.9, 0.9, 0.9, 1.0 );
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m_CopperColor = SFVEC4F( 0.75, 0.61, 0.23, 1.0 );
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m_platedPadsFront = nullptr;
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m_platedPadsBack = nullptr;
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m_frontPlatedPadPolys = nullptr;
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m_backPlatedPadPolys = nullptr;
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// Avoid raytracing options not initialized:
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m_RtShadowSampleCount = 0;
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m_RtReflectionSampleCount = 0;
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m_RtRefractionSampleCount = 0;
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m_RtSpreadShadows = 0.0;
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m_RtSpreadReflections = 0.0;
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m_RtSpreadRefractions = 0.0;
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m_RtRecursiveReflectionCount = 0;
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m_RtRecursiveRefractionCount = 0;
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}
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BOARD_ADAPTER::~BOARD_ADAPTER()
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{
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destroyLayers();
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}
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bool BOARD_ADAPTER::Is3dLayerEnabled( PCB_LAYER_ID aLayer ) const
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{
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wxASSERT( aLayer < PCB_LAYER_ID_COUNT );
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if( m_board && !m_board->IsLayerEnabled( aLayer ) )
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return false;
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// see if layer needs to be shown
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// check the flags
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switch( aLayer )
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{
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case B_Adhes:
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case F_Adhes:
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return GetFlag( FL_ADHESIVE );
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case B_Paste:
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case F_Paste:
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return GetFlag( FL_SOLDERPASTE );
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case B_SilkS:
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case F_SilkS:
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return GetFlag( FL_SILKSCREEN );
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case B_Mask:
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case F_Mask:
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return GetFlag( FL_SOLDERMASK );
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case Dwgs_User:
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case Cmts_User:
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if( GetFlag( FL_USE_REALISTIC_MODE ) )
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return false;
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return GetFlag( FL_COMMENTS );
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case Eco1_User:
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case Eco2_User:
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if( GetFlag( FL_USE_REALISTIC_MODE ) )
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return false;
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return GetFlag( FL_ECO );
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case Edge_Cuts:
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if( GetFlag( FL_SHOW_BOARD_BODY ) || GetFlag( FL_USE_REALISTIC_MODE ) )
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return false;
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return true;
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case Margin:
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if( GetFlag( FL_USE_REALISTIC_MODE ) )
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return false;
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return true;
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case B_Cu:
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case F_Cu:
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return m_board->IsLayerVisible( aLayer ) || GetFlag( FL_USE_REALISTIC_MODE );
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default:
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// the layer is an internal copper layer, used the visibility
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return m_board && m_board->IsLayerVisible( aLayer );
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}
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}
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bool BOARD_ADAPTER::GetFlag( DISPLAY3D_FLG aFlag ) const
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{
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wxASSERT( aFlag < FL_LAST );
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return m_drawFlags[aFlag];
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}
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void BOARD_ADAPTER::SetFlag( DISPLAY3D_FLG aFlag, bool aState )
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{
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wxASSERT( aFlag < FL_LAST );
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m_drawFlags[aFlag] = aState;
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}
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bool BOARD_ADAPTER::IsFootprintShown( FOOTPRINT_ATTR_T aFPAttributes ) const
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{
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if( aFPAttributes & FP_SMD )
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return GetFlag( FL_FP_ATTRIBUTES_NORMAL_INSERT );
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else if( aFPAttributes & FP_THROUGH_HOLE )
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return GetFlag( FL_FP_ATTRIBUTES_NORMAL );
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else
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return GetFlag( FL_FP_ATTRIBUTES_VIRTUAL );
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}
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// !TODO: define the actual copper thickness by user from board stackup
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#define COPPER_THICKNESS Millimeter2iu( 0.035 ) // for 35 um
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// The solder mask layer (and silkscreen) thickness
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#define TECH_LAYER_THICKNESS Millimeter2iu( 0.025 )
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// The solder paste thickness is chosen bigger than the solder mask layer
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// to be sure is covers the mask when overlapping.
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#define SOLDERPASTE_LAYER_THICKNESS Millimeter2iu( 0.04 )
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int BOARD_ADAPTER::GetHolePlatingThickness() const noexcept
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{
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return m_board ? m_board->GetDesignSettings().GetHolePlatingThickness()
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: 0.035 * PCB_IU_PER_MM;
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}
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unsigned int BOARD_ADAPTER::GetCircleSegmentCount( float aDiameter3DU ) const
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{
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wxASSERT( aDiameter3DU > 0.0f );
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return GetCircleSegmentCount( (int)( aDiameter3DU / m_biuTo3Dunits ) );
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}
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unsigned int BOARD_ADAPTER::GetCircleSegmentCount( int aDiameterBIU ) const
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{
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wxASSERT( aDiameterBIU > 0 );
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return GetArcToSegmentCount( aDiameterBIU / 2, ARC_HIGH_DEF, 360.0 );
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}
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void BOARD_ADAPTER::InitSettings( REPORTER* aStatusReporter, REPORTER* aWarningReporter )
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{
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wxLogTrace( m_logTrace, wxT( "BOARD_ADAPTER::InitSettings" ) );
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if( aStatusReporter )
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aStatusReporter->Report( _( "Build board outline" ) );
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wxString msg;
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const bool succeedToGetBoardPolygon = createBoardPolygon( &msg );
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if( aWarningReporter )
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{
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if( !succeedToGetBoardPolygon )
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aWarningReporter->Report( msg, RPT_SEVERITY_WARNING );
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else
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aWarningReporter->Report( wxEmptyString );
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}
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// Calculates the board bounding box (board outlines + items)
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// to ensure any item, even outside the board outlines can be seen
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bool boardEdgesOnly = true;
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if( ( m_board && m_board->IsFootprintHolder() ) || !GetFlag( FL_USE_REALISTIC_MODE )
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|| !succeedToGetBoardPolygon )
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boardEdgesOnly = false;
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EDA_RECT bbbox;
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if( m_board )
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bbbox = m_board->ComputeBoundingBox( boardEdgesOnly );
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// Gives a non null size to avoid issues in zoom / scale calculations
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if( ( bbbox.GetWidth() == 0 ) && ( bbbox.GetHeight() == 0 ) )
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bbbox.Inflate( Millimeter2iu( 10 ) );
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m_boardSize = bbbox.GetSize();
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m_boardPos = bbbox.Centre();
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wxASSERT( (m_boardSize.x > 0) && (m_boardSize.y > 0) );
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m_boardPos.y = -m_boardPos.y; // The y coord is inverted in 3D viewer
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m_copperLayersCount = m_board ? m_board->GetCopperLayerCount() : 2;
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// Ensure the board has 2 sides for 3D views, because it is hard to find
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// a *really* single side board in the true life...
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if( m_copperLayersCount < 2 )
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m_copperLayersCount = 2;
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// Calculate the conversion to apply to all positions.
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m_biuTo3Dunits = RANGE_SCALE_3D / std::max( m_boardSize.x, m_boardSize.y );
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m_epoxyThickness3DU = m_board
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? m_board->GetDesignSettings().GetBoardThickness() * m_biuTo3Dunits
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: 1.6 * PCB_IU_PER_MM * m_biuTo3Dunits;
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// !TODO: use value defined by user (currently use default values by ctor
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m_copperThickness3DU = COPPER_THICKNESS * m_biuTo3Dunits;
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m_nonCopperLayerThickness3DU = TECH_LAYER_THICKNESS * m_biuTo3Dunits;
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m_solderPasteLayerThickness3DU = SOLDERPASTE_LAYER_THICKNESS * m_biuTo3Dunits;
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// Init Z position of each layer
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// calculate z position for each copper layer
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// Zstart = -m_epoxyThickness / 2.0 is the z position of the back (bottom layer) (layer id = 31)
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// Zstart = +m_epoxyThickness / 2.0 is the z position of the front (top layer) (layer id = 0)
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// all unused copper layer z position are set to 0
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// ____==__________==________==______ <- Bottom = +m_epoxyThickness / 2.0,
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// | | Top = Bottom + m_copperThickness
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// |__________________________________|
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// == == == == <- Bottom = -m_epoxyThickness / 2.0,
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// Top = Bottom - m_copperThickness
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unsigned int layer;
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for( layer = 0; layer < m_copperLayersCount; ++layer )
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{
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m_layerZcoordBottom[layer] = m_epoxyThickness3DU / 2.0f -
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(m_epoxyThickness3DU * layer / (m_copperLayersCount - 1) );
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if( layer < (m_copperLayersCount / 2) )
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m_layerZcoordTop[layer] = m_layerZcoordBottom[layer] + m_copperThickness3DU;
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else
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m_layerZcoordTop[layer] = m_layerZcoordBottom[layer] - m_copperThickness3DU;
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}
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#define layerThicknessMargin 1.1
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const float zpos_offset = m_nonCopperLayerThickness3DU * layerThicknessMargin;
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// Fill remaining unused copper layers and back layer zpos
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// with -m_epoxyThickness / 2.0
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for( ; layer < MAX_CU_LAYERS; layer++ )
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{
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m_layerZcoordBottom[layer] = -(m_epoxyThickness3DU / 2.0f);
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m_layerZcoordTop[layer] = -(m_epoxyThickness3DU / 2.0f) - m_copperThickness3DU;
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}
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// This is the top of the copper layer thickness.
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const float zpos_copperTop_back = m_layerZcoordTop[B_Cu];
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const float zpos_copperTop_front = m_layerZcoordTop[F_Cu];
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// calculate z position for each non copper layer
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// Solder mask and Solder paste have the same Z position
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for( int layer_id = MAX_CU_LAYERS; layer_id < PCB_LAYER_ID_COUNT; ++layer_id )
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{
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float zposTop;
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float zposBottom;
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switch( layer_id )
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{
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case B_Adhes:
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zposBottom = zpos_copperTop_back - 2.0f * zpos_offset;
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zposTop = zposBottom - m_nonCopperLayerThickness3DU;
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break;
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case F_Adhes:
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zposBottom = zpos_copperTop_front + 2.0f * zpos_offset;
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zposTop = zposBottom + m_nonCopperLayerThickness3DU;
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break;
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case B_Mask:
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zposBottom = zpos_copperTop_back;
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zposTop = zpos_copperTop_back - m_nonCopperLayerThickness3DU;
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break;
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case B_Paste:
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zposBottom = zpos_copperTop_back;
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zposTop = zpos_copperTop_back - m_solderPasteLayerThickness3DU;
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break;
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case F_Mask:
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zposBottom = zpos_copperTop_front;
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zposTop = zpos_copperTop_front + m_nonCopperLayerThickness3DU;
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break;
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case F_Paste:
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zposBottom = zpos_copperTop_front;
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zposTop = zpos_copperTop_front + m_solderPasteLayerThickness3DU;
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break;
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case B_SilkS:
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zposBottom = zpos_copperTop_back - 1.0f * zpos_offset;
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zposTop = zposBottom - m_nonCopperLayerThickness3DU;
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break;
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case F_SilkS:
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zposBottom = zpos_copperTop_front + 1.0f * zpos_offset;
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zposTop = zposBottom + m_nonCopperLayerThickness3DU;
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break;
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// !TODO: review
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default:
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zposTop = zpos_copperTop_front + (layer_id - MAX_CU_LAYERS + 3.0f) * zpos_offset;
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zposBottom = zposTop - m_nonCopperLayerThickness3DU;
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break;
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}
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m_layerZcoordTop[layer_id] = zposTop;
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m_layerZcoordBottom[layer_id] = zposBottom;
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}
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m_boardCenter = SFVEC3F( m_boardPos.x * m_biuTo3Dunits, m_boardPos.y * m_biuTo3Dunits, 0.0f );
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SFVEC3F boardSize = SFVEC3F( m_boardSize.x * m_biuTo3Dunits, m_boardSize.y * m_biuTo3Dunits,
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0.0f );
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boardSize /= 2.0f;
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SFVEC3F boardMin = ( m_boardCenter - boardSize );
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SFVEC3F boardMax = ( m_boardCenter + boardSize );
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boardMin.z = m_layerZcoordTop[B_Adhes];
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boardMax.z = m_layerZcoordTop[F_Adhes];
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m_boardBoundingBox = BBOX_3D( boardMin, boardMax );
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#ifdef PRINT_STATISTICS_3D_VIEWER
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unsigned stats_startCreateBoardPolyTime = GetRunningMicroSecs();
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#endif
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if( aStatusReporter )
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aStatusReporter->Report( _( "Create layers" ) );
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createLayers( aStatusReporter );
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}
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extern bool BuildFootprintPolygonOutlines( BOARD* aBoard, SHAPE_POLY_SET& aOutlines,
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int aErrorMax, int aChainingEpsilon,
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OUTLINE_ERROR_HANDLER* aErrorHandler = nullptr );
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bool BOARD_ADAPTER::createBoardPolygon( wxString* aErrorMsg )
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{
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m_board_poly.RemoveAllContours();
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if( !m_board )
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return false;
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bool success;
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if( m_board->IsFootprintHolder() )
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{
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if( !m_board->GetFirstFootprint() )
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{
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if( aErrorMsg )
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*aErrorMsg = _( "No footprint loaded." );
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return false;
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}
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int chainingEpsilon = Millimeter2iu( 0.02 ); // max dist from one endPt to next startPt
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success = BuildFootprintPolygonOutlines( m_board, m_board_poly,
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m_board->GetDesignSettings().m_MaxError,
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chainingEpsilon );
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// Make polygon strictly simple to avoid issues (especially in 3D viewer)
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m_board_poly.Simplify( SHAPE_POLY_SET::PM_STRICTLY_SIMPLE );
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if( !success && aErrorMsg )
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{
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*aErrorMsg = _( "Footprint outline is missing or malformed. Run Footprint Checker for "
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"a full analysis." );
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}
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}
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else
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{
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success = m_board->GetBoardPolygonOutlines( m_board_poly );
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if( !success && aErrorMsg )
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*aErrorMsg = _( "Board outline is missing or malformed. Run DRC for a full analysis." );
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}
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return success;
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}
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float BOARD_ADAPTER::GetFootprintZPos( bool aIsFlipped ) const
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{
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if( aIsFlipped )
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{
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if( GetFlag( FL_SOLDERPASTE ) )
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return m_layerZcoordBottom[B_SilkS];
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else
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return m_layerZcoordBottom[B_Paste];
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}
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else
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{
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if( GetFlag( FL_SOLDERPASTE ) )
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return m_layerZcoordTop[F_SilkS];
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else
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return m_layerZcoordTop[F_Paste];
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}
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}
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SFVEC4F BOARD_ADAPTER::GetLayerColor( PCB_LAYER_ID aLayerId ) const
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{
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wxASSERT( aLayerId < PCB_LAYER_ID_COUNT );
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const COLOR4D color = m_colors->GetColor( aLayerId );
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return SFVEC4F( color.r, color.g, color.b, color.a );
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}
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SFVEC4F BOARD_ADAPTER::GetItemColor( int aItemId ) const
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{
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return GetColor( m_colors->GetColor( aItemId ) );
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}
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SFVEC4F BOARD_ADAPTER::GetColor( COLOR4D aColor ) const
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{
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return SFVEC4F( aColor.r, aColor.g, aColor.b, aColor.a );
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}
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