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Translated using Weblate (Chinese (Traditional Han script))

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Currently translated at 91.3% (9086 of 9948 strings)

Translation: KiCad EDA/master source
Translate-URL: https://hosted.weblate.org/projects/kicad/master-source/zh_Hant/
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reimu105 2025-01-30 08:17:26 +00:00 committed by Hosted Weblate
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translation/pofiles/zh_TW.po
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@ -19,8 +19,8 @@ msgstr ""
"Project-Id-Version: KiCad\n"
"Report-Msgid-Bugs-To: \n"
"POT-Creation-Date: 2025-01-29 19:59+0300\n"
"PO-Revision-Date: 2025-01-29 16:58+0000\n"
"Last-Translator: John Beard <john.j.beard@gmail.com>\n"
"PO-Revision-Date: 2025-01-31 09:02+0000\n"
"Last-Translator: reimu105 <peter112548@gmail.com>\n"
"Language-Team: Chinese (Traditional Han script) <https://hosted.weblate.org/"
"projects/kicad/master-source/zh_Hant/>\n"
"Language: zh_TW\n"
@ -34483,10 +34483,11 @@ msgid ""
"This value can be overridden on a pad-by-pad basis in the Local\n"
"Clearance and Settings tab of Pad Properties."
msgstr ""
"這是該封裝的焊盤與阻焊之間的局部間隙。\n"
"如果為 0 時, 使用全域設置值。\n"
"在焊盤屬性的局部間隙和設置 選項卡中, \n"
"可以覆蓋此值。"
"這是焊盤和阻焊層之間的局部間隙\n"
"這個封裝。\n"
"如果為 0，則使用全域值。\n"
"該值可以在本地逐個焊盤的基礎上被覆蓋\n"
"焊盤屬性的間隙和設定選項卡。"
#: pcbnew/dialogs/dialog_footprint_properties_fp_editor_base.cpp:278
msgid ""
@ -43475,14 +43476,13 @@ msgid "(SMD pad has no outer layers)"
msgstr "警告: 表面黏著焊盤沒有外形層。"
#: pcbnew/pad.cpp:2283
#, fuzzy
msgid "(Pad must have a positive size)"
msgstr "錯誤: 焊盤必須具有正尺寸。"
msgstr "（焊盤大小必須為正）"
#: pcbnew/pad.cpp:2294
#, fuzzy, c-format
#, c-format
msgid "(PTH pad hole size must be larger than %s)"
msgstr "貫孔孔徑尺寸必須小於貫孔直徑"
msgstr "（PTH焊盤孔尺寸必須大於%s）"
#: pcbnew/pad.cpp:2318
#, fuzzy
@ -43495,35 +43495,30 @@ msgid "(PTH pad hole not fully inside copper)"
msgstr "(金屬化焊盤的孔沒留下銅)"
#: pcbnew/pad.cpp:2335
#, fuzzy
msgid "(pad hole not inside pad shape)"
msgstr "警告: 焊盤孔不在焊盤形狀內。"
msgstr "（焊盤孔不在焊盤形狀內部）"
#: pcbnew/pad.cpp:2340
#, fuzzy
msgid "(negative local clearance values have no effect)"
msgstr "警告: 局部間隙值為負將沒有效果。"
msgstr "（負局部間隙值無效）"
#: pcbnew/pad.cpp:2359
#, fuzzy
msgid ""
"(negative solder mask clearance is larger than some shape primitives; "
"results may be surprising)"
msgstr "警告: 負阻焊間隙大於某些形狀原基板。可能產生意料之外的結果。"
msgstr "（負阻焊層間隙大於某些形狀原型；結果可能令人驚訝）"
#: pcbnew/pad.cpp:2369
#, fuzzy
msgid ""
"(negative solder mask clearance is larger than pad; no solder mask will be "
"generated)"
msgstr "警告: 阻焊層的負間隙大於焊盤。不會產生阻焊層。"
msgstr "（負阻焊層間隙大於焊盤；不會產生阻焊層）"
#: pcbnew/pad.cpp:2388
#, fuzzy
msgid ""
"(negative solder paste margin is larger than pad; no solder paste mask will "
"be generated)"
msgstr "警告: 負錫膏邊緣大於焊盤。不會生成錫膏層。"
msgstr "（負錫膏餘量大於焊盤；不會產生錫膏層）"
#: pcbnew/pad.cpp:2395
msgid "(negative corner radius is not allowed)"