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Merge branch 'master' into 'master'

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Refactor pad thickness calculations to use actual copper thickness instead of...

See merge request kicad/code/kicad!2262
This commit is contained in:
Alihossein Sepahvand 2025-09-11 17:44:25 -06:00
commit c651f4ffde
5 changed files with 21 additions and 3 deletions
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2
common/jobs/job_export_pcb_3d.h
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@ -56,6 +56,7 @@ public:
m_FuseShapes( false ),
m_FillAllVias( false ),
m_OptimizeStep( true ),
m_ExtraPadThickness( true ),
m_Format( FORMAT::STEP ),
m_OutputFile()
{};
@ -98,6 +99,7 @@ public:
bool m_FuseShapes;
bool m_FillAllVias;
bool m_OptimizeStep;
bool m_ExtraPadThickness;
FORMAT m_Format;
wxString m_OutputFile;

6
kicad/cli/command_pcb_export_3d.cpp
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@ -50,6 +50,7 @@
#define ARG_FUSE_SHAPES "--fuse-shapes"
#define ARG_FILL_ALL_VIAS "--fill-all-vias"
#define ARG_NO_OPTIMIZE_STEP "--no-optimize-step"
#define ARG_NO_EXTRA_PAD_THICKNESS "--no-extra-pad-thickness"
#define ARG_NET_FILTER "--net-filter"
#define ARG_FORMAT "--format"
#define ARG_VRML_UNITS "--units"
@ -165,6 +166,10 @@ CLI::PCB_EXPORT_3D_COMMAND::PCB_EXPORT_3D_COMMAND( const std::string& aNa
.help( UTF8STDSTR( _( "Don't cut via holes in conductor layers." ) ) )
.flag();
m_argParser.add_argument( ARG_NO_EXTRA_PAD_THICKNESS )
.help( UTF8STDSTR( _( "Disable extra pad thickness (pads will have normal thickness)" ) ) )
.flag();
m_argParser.add_argument( ARG_MIN_DISTANCE )
.default_value( std::string( "0.01mm" ) )
.help( UTF8STDSTR( _( "Minimum distance between points to treat them as separate "
@ -231,6 +236,7 @@ int CLI::PCB_EXPORT_3D_COMMAND::doPerform( KIWAY& aKiway )
params.m_ExportSoldermask = m_argParser.get<bool>( ARG_INCLUDE_SOLDERMASK );
params.m_FuseShapes = m_argParser.get<bool>( ARG_FUSE_SHAPES );
params.m_FillAllVias = m_argParser.get<bool>( ARG_FILL_ALL_VIAS );
params.m_ExtraPadThickness = !m_argParser.get<bool>( ARG_NO_EXTRA_PAD_THICKNESS );
params.m_BoardOnly = m_argParser.get<bool>( ARG_BOARD_ONLY );
params.m_NetFilter = From_UTF8( m_argParser.get<std::string>( ARG_NET_FILTER ).c_str() );
params.m_ComponentFilter =

1
pcbnew/exporters/step/exporter_step.cpp
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@ -725,6 +725,7 @@ bool EXPORTER_STEP::buildBoard3DShapes()
m_pcbModel->SetEnabledLayers( m_layersToExport );
m_pcbModel->SetFuseShapes( m_params.m_FuseShapes );
m_pcbModel->SetNetFilter( m_params.m_NetFilter );
m_pcbModel->SetExtraPadThickness( m_params.m_ExtraPadThickness );
// Note: m_params.m_BoardOutlinesChainingEpsilon is used only to build the board outlines,
// not to set OCC chaining epsilon (much smaller)

13
pcbnew/exporters/step/step_pcb_model.cpp
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@ -786,6 +786,7 @@ STEP_PCB_MODEL::STEP_PCB_MODEL( const wxString& aPcbName, REPORTER* aReporter )
m_minx = 1.0e10; // absurdly large number; any valid PCB X value will be smaller
m_pcbName = aPcbName;
m_fuseShapes = false;
m_extraPadThickness = true;
m_outFmt = OUTPUT_FORMAT::FMT_OUT_UNKNOWN;
}
@ -819,7 +820,7 @@ bool STEP_PCB_MODEL::AddPadShape( const PAD* aPad, const VECTOR2D& aOrigin, bool
double Zpos, thickness;
getLayerZPlacement( pcb_layer, Zpos, thickness );
if( !aVia )
if( !aVia && m_extraPadThickness )
{
// Pad surface as a separate face for FEM simulations.
if( pcb_layer == F_Cu )
@ -883,7 +884,7 @@ bool STEP_PCB_MODEL::AddPadShape( const PAD* aPad, const VECTOR2D& aOrigin, bool
getLayerZPlacement( F_Cu, f_pos, f_thickness );
getLayerZPlacement( B_Cu, b_pos, b_thickness );
if( !aVia )
if( !aVia && m_extraPadThickness )
{
// Pad surface is slightly thicker
f_thickness += c_padExtraThickness;
@ -979,7 +980,7 @@ bool STEP_PCB_MODEL::AddHole( const SHAPE_SEGMENT& aShape, int aPlatingThickness
// must be > OCC_MAX_DISTANCE_TO_MERGE_POINTS
// Pads are taller by 0.01 mm
if( !aVia )
if( !aVia && m_extraPadThickness)
margin += 0.01;
double f_pos, f_thickness;
@ -1295,6 +1296,12 @@ void STEP_PCB_MODEL::SetNetFilter( const wxString& aFilter )
}
void STEP_PCB_MODEL::SetExtraPadThickness( bool aValue )
{
m_extraPadThickness = aValue;
}
void STEP_PCB_MODEL::SetCopperColor( double r, double g, double b )
{
m_copperColor[0] = r;

2
pcbnew/exporters/step/step_pcb_model.h
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@ -128,6 +128,7 @@ public:
void SetSimplifyShapes( bool aValue );
void SetStackup( const BOARD_STACKUP& aStackup );
void SetNetFilter( const wxString& aFilter );
void SetExtraPadThickness( bool aValue );
// Set the max distance (in mm) to consider 2 points have the same coordinates
// and can be merged
@ -260,6 +261,7 @@ private:
bool m_hasPCB; // set true if CreatePCB() has been invoked
bool m_simplifyShapes; // convert parts of outlines to arcs where possible
bool m_fuseShapes; // fuse geometry together
bool m_extraPadThickness; // add extra thickness to pads equal to copper thickness
std::vector<TDF_Label> m_pcb_labels; // labels for the PCB model (one by main outline)
MODEL_MAP m_models; // map of file names to model labels
int m_components; // number of successfully loaded components;