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reverting pad adding extra pad thickness to be the same as copper thinckness. I left enabling or disabling extrapad thickness in there.
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@ -814,15 +814,13 @@ bool STEP_PCB_MODEL::AddPadShape( const PAD* aPad, const VECTOR2D& aOrigin, bool
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double Zpos, thickness;
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getLayerZPlacement( pcb_layer, Zpos, thickness );
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double copperExtraThickness = std::abs( thickness ); // Use actual copper thickness
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if( !aVia && m_extraPadThickness )
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{
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// Pad surface as a separate face for FEM simulations.
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if( pcb_layer == F_Cu )
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thickness += copperExtraThickness;
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thickness += c_padExtraThickness;
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else if( pcb_layer == B_Cu )
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thickness -= copperExtraThickness;
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thickness -= c_padExtraThickness;
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}
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TopoDS_Shape testShape;
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@ -884,10 +882,8 @@ bool STEP_PCB_MODEL::AddPadShape( const PAD* aPad, const VECTOR2D& aOrigin, bool
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if( !aVia && m_extraPadThickness )
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{
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// Pad surface is slightly thicker
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double f_copperExtraThickness = std::abs( f_thickness );
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double b_copperExtraThickness = std::abs( b_thickness );
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f_thickness += f_copperExtraThickness;
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b_thickness -= b_copperExtraThickness;
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f_thickness += c_padExtraThickness;
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b_thickness -= c_padExtraThickness;
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}
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double top = std::max( f_pos, f_pos + f_thickness );
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@ -978,17 +974,9 @@ bool STEP_PCB_MODEL::AddHole( const SHAPE_SEGMENT& aShape, int aPlatingThickness
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// is bigger than the board with copper
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// must be > OCC_MAX_DISTANCE_TO_MERGE_POINTS
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// Pads are taller by the actual copper thickness on both top and bottom
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// Pads are taller by 0.01 mm
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if( !aVia && m_extraPadThickness)
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{
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double f_pos, f_thickness;
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double b_pos, b_thickness;
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getLayerZPlacement( F_Cu, f_pos, f_thickness );
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getLayerZPlacement( B_Cu, b_pos, b_thickness );
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double f_copperExtraThickness = std::abs( f_thickness );
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double b_copperExtraThickness = std::abs( b_thickness );
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margin += f_copperExtraThickness + b_copperExtraThickness;
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}
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margin += 0.01;
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double f_pos, f_thickness;
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double b_pos, b_thickness;
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